Dual curing epoxy meets biocompatibility and cytotoxicity demands
Subs & Systems
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound offering a UV and heat curing mechanism. As well as passing USP Class VI tests for biocompatibility, it also meets ISO 10993-5 for cytotoxicity, making it excellent for many applications in the medical device industry.
As a nanosilica filled system, the product provides low shrinkage upon cure, outstanding abrasion resistance and dimensional stability with a low coefficient of thermal expansion of 30-35 x 10-6"/"/C. It is a reliable electrical insulator with a volume resistivity of more than 1014Ohm-cm and dielectric constant of 3.85 at 60Hz. The compound is optically clear with a refractive index of 1.52.
The UV curing process for system takes only 10-30 seconds at a 365nm wavelength and 10-40mW/cm2 of UV output. The heat curing process can be initiated at 80C, making it extremely desirable in applications concerning heat sensitive components. Optional post curing at 125-150C for 15-30 minutes will improve the glass transition temperature to over 125C. This system is not oxygen inhibited.
The system has a low viscosity of 500-3,500cps at 75F (~23C). It bonds favourably to a mixture of substrates including glass, metals, ceramics and most plastics. This compound has extremely good resistance to various sterilisation methods including autoclaving and many chemical sterilants. It is offered for use in 30cc EFD syringes, half a pint, pint, and quart containers.