Master Bond EP70CN is a two-part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for sealing, bonding, coating and potting. “The tensile strength is 11,000 to 12,000psi and the tensile modulus, 300,000 to 350,000psi. It features a glass transition temperature of 130C to 135C,” says Rohit Ramnath, senior product engineer. “The EP70CN has a very good chemical resistance profile when cured at the optimal cure schedule.” It is a low viscosity formulation with a diverse viscosity of 2,500 to 5,000cps. With a long working life of 60 to 90 minutes and a mixture of curing options, the optimal cure schedule is overnight at room temperature followed by 3-4 hours at 140F to 170F. The product bonds well to an extensive variety of substrates which includes ceramics, metals and many rubbers, plastic materials, and particularly composites with low shrinkage upon cure. It provides excellent wetting properties which makes it suitable for applications using bonding and sealing fibres. The product has a high volume resistivity (greater than 1014ohm-cm) and a comparatively low exotherm. This mixture of properties allows it to be used in multiple encapsulating applications. The product can be used in electronic, aerospace, optoelectronic and OEM applications, especially those comprising composites and fibres.