Highlighting a blend of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy designed for glob top and chip coating applications. Furthermore, this system can also be employed for encapsulation and bonding. The epoxy cures within two to three hours at 175F-185F (80C-85C), which is beneficial for use on heat sensitive components and substrates.
The epoxy is a toughened adhesive system that bonds favourably to a mixture of similar and dissimilar substrates. It provides a high volume resistivity of more than 1014ohm-cm and a thermal conductivity of 5-10BTU•in/ft2•hr•F [0.72-1.44W/(m•K)]. The system is serviceable from -100F to +350F (-73C to +177C).
Since the epoxy is not premixed and frozen, it offers a long open time at room temperature and is more convenient to handle and store than conventional two-component glob top systems. This opaque black compound has a thixotropic paste-like consistency and is simple to apply either manually or with an automated dispenser. The epoxy is offered for use in common size syringes ranging from 10cc to 30cc as well as in standard size containers.