New non-silicone-based gap fillers deliver high performance

Laird Technologies’ new Tflex SF7 and Tflex SF4 non-silicone-based gap filler materials are high-performance thermal transfer solutions. Each displays outstanding deflection properties, providing minimal pressure on components during assembly and thus minimising board and component stress. Very little pressure is required to reach the lowest possible thermal resistance.

Tflex SF7, with its 7.8Wm/K thermal conductivity and extremely low 0.057 thermal resistance (°C in 2/w), improves integrated circuit performance in automotive industry applications. Joining it is Tflex SF4 which delivers 4W/mK thermal conductivity and low 0.07 thermal resistance (°C in 2/w).

Both non-silicone-based formulations supply low peak and residual pressure capabilities and feature exceptional surface wetting for low contact resistance.