New 3.5" application carrier board for COM-HPC Mini modules

24-04-2024 | Congatec | Industrial

congatec offers the first board-level product in line with its recently introduced aReady. strategy. Application-ready for immediate deployment in industrial use cases, the new 3.5" conga-HPC/3.5-Mini carrier board is created for space-constrained rugged high-performance IIoT applications that are based on COM-HPC Mini modules with extended temperature support from -40C to +85C. When used in combination with the conga-aCOM/mRLP COM-HPC Mini module in aReady.COM version, the hypervisor and operating system configuration come pre-installed. A software expansion package for secure IIoT connection is on the roadmap. Developers can boot product bundles and install their applications immediately. As this minimises the complexity of integration below the application layer and for the diverse IIoT functionalities of embedded and edge computing systems, the solution is also excellent for system integrators.

There are two purchasing options for this new COTS carrier board. As a pure application carrier board with the module, it is an ideal platform for series products starting from small quantities. For application-specific designs, the complete aReady. bundle provides high convenience and design security. For instance, possible configurations can include a pre-installed ctrlX OS from Bosch Rexroth and virtual machines for tasks such as real-time control, HMI, AI, IIoT data exchange, firewall and maintenance/management functions. These purchasing options are ideal for OEMs looking to develop sustainable system designs based on off-the-shelf components. Modular COTS configurations are primarily aimed at OEMs, system integrators and VARs of smaller industrial product series and families. What makes the solution sustainable is the option to replace only the module when performance and functionality requirements change, instead of the complete embedded hardware.

Heralding an application-specific modular embedded computing platform in a 3.5" format, offer options providing an excellent technological foundation for rapid prototyping and price/performance balancing through processor selection. Customer-specific carrier board variants allow OEMs to realise dedicated designs with minimal development effort. This reduces costs, shortens time-to-market, and secures long-term investments in specific carrier board designs as upgrades are possible by swapping modules across processor generations and manufacturers. Larger production runs can also be realised cost-efficiently by merging the COM and carrier board.

“Minimising the integration effort to the greatest extent possible provides immense added value for our customers. From our core Computer-on-Module business perspective, both the COTS carrier boards and the aReady. strategy with pre-installed hypervisor, operating system, and IIoT software configurations are therefore important add-on benefits that we can now offer customers for our modules. Customer-specific designs tailored through our design-in services are then the next step to further minimise OEMs’ workloads,” explains Jürgen Jungbauer, senior product line manager at congatec.

sebastian_springall.jpg

By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.