Congatec

New carrier board design training program accelerates knowledge transfer

03-03-2023 | Test & Measurement

Small form factor COM-HPC to complete high-performance ecosystem

15-02-2023 | Industrial

Fastest client COMs generation is now available

11-01-2023 | Industrial

COMs performance boost now standard-compliant

02-12-2022 | Industrial

Accelerating real-time digitisation solutions

17-11-2022 | Boards

High-performance COM-HPC carrier board in Micro-ATX form factor

27-07-2022 | Subs & Systems

Simplifying Arm deployments with SMARC Computer-on-Module

23-05-2022 | Subs & Systems

Embedded computing engines puts smart vehicle developers in the fast lane

04-04-2022 | Automotive & Transport

Simplifying COM-HPC designs

14-02-2022 | Development Boards

Ten new COM-HPC and COM Express CoMs with 12th Gen Intel Core processors

11-01-2022 | Subs & Systems

Ultra-rugged 11th Gen Intel Core modules are shock and vibration resistant

19-07-2021 | Subs & Systems

Extended temperature range platforms for edge computing

23-02-2021 | Subs & Systems

Much more power on a smaller footprint

19-11-2020 | Subs & Systems

First COM-HPC and next-gen COM Express now available

09-09-2020 | Subs & Systems