High value, industrial thin motherboard solution for IoT connected devices

Congatec has introduced the conga-IC175, a thin industrial-grade motherboard family featuring the new 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices. The new boards are perfectly suited for space-constrained, high-performance, low-power IoT designs. Besides all the enhancements of the new processor generation, they also offer comprehensive IoT support including a SIM card socket for 3G/4G or Narrow Band connectivity and first versions of the company’s Cloud-API. The extremely low profile design of the motherboard family makes it perfectly suited for slim system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals, and medical tablets. The boards excel through the option of ultra-fast Intel Optane memory via M.2 connector, enabling extremely fast system boots, application starts, video recording and processing, and software updates. The boards further support Hyper-Threading which turns the dual-core design into a 4-in-1 system when utilizing the RTS real time hypervisor. "Our new thin Mini-ITX motherboards can be universally employed in all the various embedded and IoT applications as the new low-power versions of the high-end 64-bit Intel Core processors offer a highly configurable thermal design power (TDP) of 15W, with the flexibility to scale dissipation from 7.5W cTDP to 25W cTDP for an exceptional balance of power and performance," explains Congatec director product management, Martin Danzer. Perfectly tailored for the embedded and rugged industrial market, the new flagship motherboard design offers at least seven years long term availability as well as a comprehensive set of industrial interfaces and drivers. Thanks to their personal integration support, the design-in phase is highly simplified and becomes an easy job for OEM engineers.