Two-part nickel conductive epoxy meets NASA low outgassing specifications
Design & Manufacture
Master Bond’s EP21TDCN-LO nickel filler is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for the aerospace, electronic and specialty OEM industries including use in vacuum and clean room environments.
The product has a low volume resistivity of 5-10ohm-cm and a thermal conductivity of 11 BTU in/ft² hr degF. It is dimensionally stable and bonds well to similar and dissimilar substrates such as metals, composites, ceramics and many plastics. This epoxy feature a high strength profile including a tensile lap shear, tensile and T-peel strength of 1,400psi-1,600psi, 3,000psi-4,000psi and 15pli-20pli, respectively. It resists exposure to a variety of chemicals such as fuels, oils, organic solvents and water.
With a one to one mix ratio by weight or volume, the product is easy to handle with a smooth paste consistency. As a two part system, it can cure at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature, followed by 2-3 hours at 150F-200F. It is serviceable from -100F to +275F. It is available for use in half-pint, pint, quart, gallon and five gallon container kits. It has a shelf life of six months at ambient temperatures in its original, unopened containers.