Data Centre


New MOSFET in Source-Down packaging meets power demands in AI servers

Alpha and Omega Semiconductor Limited (AOS) has introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3x3.3 Source-Down packaging technology. Designed for high power density in DC-DC applications, the device provides features that me

Alpha and Omega Semiconductor | 26-06-2025

New SMT connectors for data centre and networking applications

Mouser Electronics, Inc. now offers the new QSFP 112G SMT connectors and cages from TE Connectivity. The connectors facilitate high-speed data transmission of up to 400Gbps per port for telecommunication, networking, data centres, and test

Mouser Electronics | 23-06-2025

Leading the industry in power efficiency for data centre and cloud AI acceleration

The importance of high-performance memory has never been greater, fuelled by its vital role in supporting the growing demands of AI training and inference workloads in data centres. Micron Technology, Inc. has announced the shipment of HBM4

Micron | 19-06-2025

Next-gen AI GPU servers with NVIDIA RTX PRO 6000 Blackwell Server Edition

Advantech is demonstrating its GPU servers for AI and IoT applications at NVIDIA GTC 2025. With the complexity of AI, HPC and data analytics increasing exponentially over the next decade, scientists and developers will need advanced computi

Advantech | 16-06-2025

Stable microwave cable assemblies to 110GHz available now

Samtec's Nitrowave high-performance microwave cables provide stability during flexure in lab test environments, ATE systems, and low-loss rugged environments such as aerospace, defence and datacom. Samtec, Inc. has announced production q

Samtec | 10-06-2025

LPDDR5X memory delivers top-speed grades and dramatic power savings

Micron Technology, Inc. has announced it is shipping qualification samples of the world's first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on flagship smartphones. Deliveri

Micron | 09-06-2025

Advancing photonic package design to address key data centre challenges

Sarcina Technology has reported advances in its photonic package design capabilities for Co-Packaged Optics (CPO), addressing fundamental challenges faced by data centres in dealing with the rapidly increasing amount of data as AI evolves.

Sarcina Technology | 06-06-2025

High-speed networking solutions expanded with 800G transceivers

Integra Optics, an Infinite Electronics brand, has announced the addition of 800G transceivers to its inventory. Designed to meet the accelerating demands of AI, cloud computing, and data centre networks, the new transceivers deliver power

Integra Optics | 05-06-2025

Team brings efficient power distribution to AI infrastructure

Texas Instruments announced that it is working with NVIDIA on the development of power management and sensing technologies for 800V HVDC power distribution systems used in data centre servers. The new power architecture paves the way for mo

Texas Instruments | 03-06-2025

Energy savings and market-leading efficiency in new UPS

Eaton has launched the 9PX Gen2 5-11kW UPS, a new product that enhances its proven 9PX solution through advanced technology upgrades and customer-centric improvements. It delivers best-in-class power management and battery backup for critic

Eaton | 03-06-2025

Revolutionising power delivery architecture for future AI server racks

Infineon Technologies AG is revolutionising the power delivery architecture needed for future AI data centres. In collaboration with NVIDIA, the company is developing the next generation of power systems based on a new architecture with cen

Infineon | 29-05-2025

Connectivity innovator offers extensive selection of connection solutions

Mouser Electronics, Inc. provides an extensive selection of solutions from Molex. As a leading global connector solutions provider, Molex brings engineering excellence, trusted relationships, and an unparalleled commitment to quality and re

Mouser Electronics | 27-05-2025

Companies develop PCIe 5.0-compatible broadband optical SSD for next-gen data centres

Kioxia Corporation, AIO Core Co., Ltd. and Kyocera Corporation have developed a PCIe 5.0-compatible broadband SSD prototype with an optical interface (broadband optical SSD). The three companies will develop technologies for broadband optic

Kyocera Corporation | 22-05-2025

12kW GaN and SiC platform for hyperscale AI data centres

Navitas Semiconductor has announced its latest 12kW PSU ‘designed for production’ reference design for hyperscale AI data centres with high-power rack densities of 120kW. The 12kW PSU complies with ORv3 specifications and OCP guidelines.

Navitas Semiconductor | 21-05-2025