New one-piece shield frame with spring fingers suits automotive EMI applications

Laird Technologies’ new BMI-S-608 one-piece EMI shielding solution has a range of applications in the automotive industry for board-level EMI management. The lightweight shield frame removes the necessity for a separate top-mount lid or cover, saving material, storage, and labour costs.

The diecast/heat sink main housing (from a separate manufacturer) is placed directly inside the company's shield frame and is clasped tightly by integrated contact spring fingers. BMI-S-608 offers cost-effective EMI shielding for components, while its spring fingers facilitate electrical contact and grounding of the diecast/heat sink. The snug fit sealing of the die-cast housing ensures it will maintain direct, surface-to-surface contact with high-thermal-load integrated circuits and reduce disruptive EMI.

BMI-S-608 enhances the design freedom of PCB layouts, allows for tighter spacing between adjacent shields, facilitates easier component repairs, and serves as an alternative to multi-component manufacturer solutions.