MOSFET delivers improved system efficiency and increased power density

06-05-2025 | Infineon | Power

Infineon Technologies AG has released its new CoolSiC MOSFET 750V G2 technology, which was created to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications. The CoolSiC MOSFETs 750V G2 technology provides a granular portfolio with typical RDS(on) values up to 60mΩ at 25C, making it suited to a wide range of applications, including OBCs, DC-DC converters, auxiliaries for electric vehicles (xEVs) and industrial applications in EV charging, solar inverter, energy storage systems, telecom and SMPS.

The ultra-low RDS(on) values 4mΩ and 7mΩ facilitate outstanding performance in static-switching applications, making the MOSFETs an excellent choice for applications such as eFuse, high-voltage battery disconnect switches, solid-state circuit breakers, and solid-state relays. The best-in-class lowest R DS(on) 4mΩ is featured in Infineon’s innovative top-side cooled Q-DPAK package, which is designed to provide optimal thermal performance and reliability.

The technology also exhibits excellent RDS(on) x Q OSS and best-in-class RDS(on) x Q fr, contributing to decreased switching loss in hard-switching and soft-switching topologies with superior efficiency in hard-switching user cases. With lowered gate charge, the technology permits faster switching and reduces gate drive losses, making them more efficient in high-frequency applications.

Also, the devices offer a combination of high threshold voltage VGS(th),typ of 4.5V at 25C and ultra-low QGD/QGS ratio, reinforcing robustness against parasitic turn-on (PTO). Furthermore, the technology permits for extended gate driving capabilities, supporting static gate voltages of up to -7V and transient gate voltages of up to -11V. This improved voltage tolerance gives engineers greater design margins and the best compatibility with other devices in the market.

The CoolSiC 750 V G2 delivers unparalleled switching performance, ease of use, and reliability with firm adherence to AEC Q101 standards for automotive-grade parts and JEDEC standard for industrial-grade parts. It allows more efficient, compact and cost-effective designs to fulfil the ever‑growing market needs and underscores its commitment to reliability and longevity in safety-critical automotive applications.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.