Mouser now stocks the Quad-Row board-to-board connectors from Molex. The connectors provide a staggered circuit layout and a 0.175mm pitch low-profile design for 30% space savings over traditional connectors. These patent-pending connectors provide product developers and device manufacturers greater freedom and flexibility to support compact form factors, making them excellent for AR/VR, automotive, communications, IoT, medical and wearable applications.
The Quad-Row board-to-board connectors adhere to the 3.0 A current rating, providing high power in a compact form. Also, the product aligns with the standard soldering pitch of 0.35mm to speed up volume manufacturing utilising typical SMT processes. Reliable, robust performance is ensured, thanks to interior armour and insert-moulded power nail, which shields pins from damage throughout volume manufacturing and assembly. These capabilities and a wide alignment facilitate easy, secure mating and low fallout rates.
“Molex continually drives connectivity innovations in support of increasingly smaller yet more powerful devices,” said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. “With the high-density, Quad-Row board-to-board connectors, our customers now can squeeze more features, sensors, and functionality into increasingly tight spaces without compromising device performance. As a result, Molex is setting a new connectivity standard for space optimisation.”
The connectors are offered in 32- and 36-pin configurations, with 20- and 64-pin configurations coming soon. Plans are underway to support up to 100-pin counts.
Applications include smartphones, wearable devices, IoT and smart home devices, AR/VR devices, drones, patient monitoring systems, therapeutic and surgical equipment and more.