congatec now offers the COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. It expects series production of OEM designs based on these new modules to ramp up swiftly as the new long-life processors provide huge improvements in many features yet are wholly hardware compatible with the predecessors, which makes implementation extremely quick and easy. With Thunderbolt and improved PCIe support up to Gen5, the modules based on the new COM-HPC standard open up new horizons for developers for data throughput, I/O bandwidth and performance density. The COM Express 3.1 compliant modules help secure investments in current OEM designs, incorporating upgrade options for more data throughput thanks to PCIe Gen4 support.
The new modules offer up to 8% single thread and up to 5% multithread performance gains from the soldered 13th Gen Intel Core processors in comparison to 12th Gen Intel Core processors. The performance gains go together with a notable higher power efficiency due to an improved manufacturing process. Also new in this performance class (15-45 W Base Power) are DDR5 memory support and PCIe Gen5 connectivity on selected SKUs, contributing to even greater multithread performance and data throughput. With up to 80 EU and ultra-fast encode and decode capabilities, the integrated Intel Iris Xe graphics architecture is ideal for enhanced graphics demands such as those seen in video streaming and video data-based situational awareness applications. All these features effect notable improvements in a wide range of industrial, medical, AI and ML applications and all types of embedded and edge computing with workload consolidation.
"The numerous improvements of the 13th Gen Intel Core processors help to make these new generations of Computer-on-Modules really outstanding. They give industry the opportunity to instantly upgrade already existing high-end embedded and edge computing solutions, which is what makes this new launch so extraordinarily significant for all our OEM customers and Value Adding Reseller partners," explains Jürgen Jungbauer, senior product line manager at congatec.
Application engineers may deploy the new COM-HPC Computer-on-Modules on the company's Micro-ATX Application Carrier Board conga-HPC/uATX for COM-HPC Client-type modules to instantly capitalise on all the benefits and improvements of these new modules together with ultra-fast PCIe Gen5 connectivity.