Diodes Incorporated had introduced a series of high-current Schottky rectifiers in ultra-compact chip-scale packages (CSPs). The DIODES SDM5U45EP3 (5A, 45V), DIODES SDM4A40EP3 (4A, 40V), and DIODES SDT4U40EP3 (4A, 40V) deliver the industry’s highest current densities in their class, satisfying market needs for smaller and more powerful electronic systems.
Each device can be utilised for assorted purposes, serving as blocking or reverse-polarity protection diodes, electrical over-stress protection diodes, and free-wheeling diodes. The rectifiers in this series are created for usage in space-constrained applications, including portable, mobile, and wearable devices and IoT hardware.
The SDT4U40EP3 is the industry’s smallest 4A trench Schottky rectifier leading the trio, the first-ever in a 1608 package. It takes 90% less PCB area than competing devices. Its 800A/cm2 current density, also the highest for a trench Schottky in the industry, is due to its patent-pending innovative cathode design and manufacturing processes. The resulting ultra-low forward voltage performance (0.47V typical) minimises power losses, enabling the design of higher efficiency systems. Moreover, its superior avalanche capability makes it strong enough to deal with severe operating conditions, including transient voltages.
The X3-TSN1616-2 packaged SDM5U45EP3 has a 2mm2 footprint, while the 1.28mm2 footprint of the X3-TSN1608-2 packaged SDM4A40EP3 and SDT4U40EP3 enable system designers to maximise board real estate in modern, highly integrated consumer products. With their 0.25mm (typical) profiles, these ultra-thin CSPs have shortened thermal paths, resulting in greater power dissipation, decreasing thermal BOM costs and increasing reliability.