Packet switch addresses fan-out and multi-host connectivity

23-05-2022 | Diodes Inc | Semiconductors

Diodes Incorporated has introduced a PCIe 3.0 packet switch IC. DIODES PI7C9X3G1632GP offers flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability. This will prove advantageous in systems dealing with AI/deep learning workloads, data storage equipment, the servers in data centres, wireless/wireline telecommunications infrastructure, and diverse forms of modern embedded hardware.

The basic architecture of the device comprises two tiles that each feature eight ports and 16 lanes, which allows it to support 32 lanes of SERDES in configuration options that span from two ports up to 16 ports. Different port types can be assigned to handle a diverse range of potential applications, such as port fan-out and connection to multiple hosts. These include upstream, downstream, and CDEP ports.

Multiple DMA channels are embedded into the device to allow more efficient data communication between the host/hosts and connected endpoints. The low packet forwarding latency exhibited (<150ns typical) means that high-performance data transmissions can be accomplished. Integration of a PCIe 3.0 clock buffer helps lower the overall BOM costs and simplifies the implementation process.

The inclusion of further features, such as advanced error reporting, error handling and end-to-end data protection, are all pivotal in providing ongoing transmission reliability. Also, operational conditions are monitored utilising the built-in thermal sensor.

Advanced power management functions allow significant energy savings, enabling the device to perform across the industrial temperature range of -40C to 85C and enables it to be employed in a wide range array of applications.

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