Ultra-rugged 11th Gen Intel Core modules are shock and vibration resistant

19-07-2021 | Congatec | Subs & Systems

Congatec has released its new 11th Gen Intel Core processor-based COMs with soldered RAM for the biggest shock and vibration resistance. Created to withstand extreme temperature ranges of -40C to +85C, the new COM Express Type 6 Computer-on-Modules offer full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.


For more price-sensitive applications, the company also offers a cost-optimised Intel Celeron based shock and vibration resistant variant for the extended temperature range from 0C to 60C. Typical customers for the new range of COMs based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, agricultural vehicles, construction machines, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. Shock and vibration resistant stationary devices are another significant application area as digitisation requires critical infrastructure protection against earthquakes and other mission-critical events. These applications can now profit from super-fast LPDDR4X RAM with up to 4266MT/s and in-band error-correcting code for single failure tolerance and high data transmission quality in EMI critical environments.


The value package incorporates rugged mounting options for the COM and carrier bundle, active and passive cooling options, a list of recommended carrier board schematics, optional conformal coating for protection against corrosion due to moisture or condensation, and for the highest reliability, shock and vibration resistant components for the extended temperature range. This remarkable technical feature set is complemented by a wide service offering that incorporates shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services and all training sessions needed to simplify the use of the company's embedded computer technologies.

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