Automotive processing innovation with two processors

08-06-2021 | NXP | Automotive Technologies

NXP Semiconductor and TSMC have announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on its advanced 16nm FinFET process technology. This marks the migration of NXP’s S32 family of processors to advanced process nodes as automobiles continue to evolve into powerful computing platforms. This continued innovation in the S32 family is intended to assist carmakers to simplify vehicle architecture and provide the fully connected and configurable car of the future.


The S32G2 vehicle networking processors facilitate service-oriented gateways for secure cloud connectivity and over-the-air updates that unlock many data-driven services including usage-based insurance and vehicle health management. These processors also work as domain and zonal controllers to facilitate next-generation vehicle architectures and as high-performance ASIL D safety processors in ADAS and autonomous drive systems. The move to TSMC’s 16nm technology has enabled S32G2 to consolidate multiple devices into one, creating a powerful SoC that reduces the processor’s footprint.


The S32R294 radar processor’s implementation in 16nm gives the performance carmakers demand to allow scalable solutions for NCAP and advanced corner radar as well as long-range front radar and advanced multi-mode use cases such as simultaneous blind-spot detection, lane change assistance and elevation sensing.


“NXP’s release of 16nm processors for radar and vehicle networking is the next milestone in turning cars into intelligent, connected robots on wheels that are safe, secure and enjoyable. Both processors are ready for volume release,” said Kurt Sievers, president and CEO of NXP Semiconductors, at the Computex CEO Forum. “We have a long history of partnership with TSMC and appreciate their support during this extraordinary period of shortage. We value our collaboration in both technology and volume manufacturing that has enabled this key step in broadening NXP’s 16nm FF portfolio and paves the way towards our future high-performance S32 processing platform with harmonised software infrastructure in TSMC’s 5nm process.”


“Vehicles have become sophisticated computing platforms with semiconductors controlling a wide range of sensors, digital cockpits, wireless connectivity, and more. TSMC’s comprehensive portfolio of automotive process technologies and services enable our customers to innovate to make cars safer, smarter, and greener,” said TSMC chief executive officer Dr CC Wei. “TSMC is dedicated to supporting NXP’s longstanding automotive excellence in design, quality and functional safety at the 16nm node and well into the future with our leading logic technologies and automotive-grade manufacturing quality.”

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