KEMET Corporation has released a new family of metal composite power inductors to meet the stringent requirements of the automotive market. The MPXV product providing enhances the company’s METCOM range and is AEC-Q200 qualified for use in the automotive sector.
The new power inductors offer efficient power conversion while reducing EMI and are excellent for use in DC to DC switching power supplies for the growing number of ECUs found in automotive systems.
The series is optimised for use within the automotive market, where the increased demand and adoption for electronic systems requires high efficiency, low self-heating, and low power losses. The series inductors’ metal composite core has a class-leading high permeability to satisfy these demands. The qualities of the inductors make them perfect for usage in designs where thermal considerations are vital to evade adverse effects to other critical systems.
Available in various industry-standard SMD footprints, the inductors can function at temperatures up to 155C and feature low electrical noise enabling them to be employed in all areas of the vehicle - as well as the challenging operating environments under the hood and in the powertrain. The metal composite material is moulded around the inductor coil core and, consequently, acts to shield neighbouring electronics from the magnetic flux that may otherwise create interference in sensitive systems. These devices are qualified to AEC-Q200 standard requirements, and they are ideal for even the most demanding areas of automotive applications.
“Our experience and expertise in high permeability inductor material development and production allow us to introduce devices with differentiated performance to meet and exceed the needs of the latest applications in sectors such as automotive,” said Dr Philip Lessner, KEMET senior vice President and chief technology officer. “With their robust performance, high reliability and energy-saving features, MPXV inductors are a perfect example of this and provide a dependable, easy-to-design-in solution.”