GaN-on-Silicon monolithic full HD microLED bonded displays available now

17-05-2019 | Plessey | Subs & Systems

Plessey has announced a notable milestone in the development of its monolithic microLED displays with its backplane partner, Jasper Display Corp.

It is continuing partnership with JDC including extensive capital investment in a complete tool set, allowing successful wafer to wafer bonding. The company has succeeded in wafer level bonding of its GaN-on-Silicon monolithic microLED wafers with JDC’s eSP70 silicon patented backplane technology, producing microLED displays that contain addressable LEDs.

The company's microLED display features an array of 1920 x 1080 (FHD) current-driven monochrome pixels on a pitch of eight microns. Each display needs more than two million individual electrical bonds to connect the microLED pixels to the controlling backplane. The JDC backplane offers independent 10-bit single colour control of each pixel. Bonding a complete LED wafer to a CMOS backplane wafer includes over 100 million micro level bonds between the wafers.

Dr Wei Sin Tan, director of Epitaxy and Advanced Product Development at Plessey, said: “This is a momentous milestone in the development of our monolithic microLED display technology. To the best of our knowledge, this is truly a WORLD FIRST, and we are extremely proud of this tremendous achievement. This is what the industry has been waiting for and opens up a new market for microLED emissive display applications.”

JDC’s VP Marketing and Product Management, T.I. Lin, said: “Plessey’s monolithic microLED array is a great match to JDC’s high-density silicon backplane. Our JD27E series demonstrates our ability to deliver what our valuable partner Plessey and the wider industry has been waiting for – silicon backplanes that have been designed with their microLED display requirements in mind.”

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