Collaboration established for tailored backplane for monolithic microLED displays
Subs & Systems
Plessey Semiconductors has established a strategic partnership with Jasper Display Corp. The company is going to utilise JDC’s silicon backplane to drive its monolithic microLED displays produced on its proprietary GaN-on-Si wafers.
The eSP70 silicon backplane is tailored for the demands of microLED devices. The full colour-capable active matrix backplane provides a resolution of 1920x1080, a pixel pitch of 8µm and gives excellent current uniformity through a proprietary current source pixel as well as flexible addressing.
By using the backplane allows Plessey the flexibility to employ its GaN-on-Si platform for microLEDs, producing very high brightness with modest power consumption or operate with low power while having daylight usable brightness levels.
JDC’s VP marketing and product management, T.I. Lin, said: “Plessey’s monolithic microLED array is a great match to JDC’s high-density silicon backplane. Our JD27E series demonstrates our ability to deliver what our valuable partner Plessey and the wider industry has been waiting for – silicon that has been designed with their microLED needs in mind. Our X-on-Silicon backplane technology for microLED can be customised on a per-project basis, allowing us to make specialised silicon suiting needs ranging from low-power AR headsets all the way to automotive headlights.”
Dr Keith Strickland, chief technology officer at Plessey, explained: “JDC’s microLED specific silicon backplane allows Plessey to rapidly bring to market our monolithic full-colour microLED array at our entry level 8µm pixel size. At Plessey, we have overcome the significant challenges involved in accurately aligning and bonding the microLED array with the backplane. We are looking forward to partnering with JDC as we continue our development, reducing pixel and display size.”