Small logic package can be used without a step-down mask

Nexperia has released the four-pin X2SON4 package which is claimed to be the smallest logic package that can be used without necessitating an expensive and fragile step-down mask. Consequently, PCB assembly is easier, quicker, more reliable and more cost-effective. The company developed the packages - part of its MicroPak package range - to offer the smallest footprint for logic functions while assuring pad pitch remains 0.4mm or over. The company’s low-power AUP, AXP, LV and LVC technology families which covers over 100 logic solutions are offered in X2SON eight, six, five and four-pin packages. The new four-pin X2SON4 package option lessens the footprint of the same function by 44% when compared to five-pin X2SON5, and by up to 64% when compared to XSON packages. Michael Lyons, senior product manager at Nexperia, commented: “X2SON4 enables the release of smaller buffers and inverters, which were previously only available in five-pin or six-pin leadless packages. All our X2SON solutions enable miniaturisation without the use of expensive and fragile step-down masks.”