Board-to-board connector features structure that absorbs alignment errors

Hirose has launched an SMT board-to-board connector that utilizes a unique three-piece floating contact system to simplify assembly and support high-speed transmission capability up to 15Gbps. Designed for high-speed transmission applications that require multiple stacking connectors on the same PCB, the 0.5mm pitch FX10-3 Series connector is the latest addition to the company’s FunctionMax family. The series mezzanine connector’s floating contact mechanism can compensate for alignment errors up to ±0.3mm in both the X- and Y-axis direction. This floating feature allows for multiple connectors to be used in a mezzanine design reducing the stress on solder joints caused by misaligned connectors. The three-piece connector utilizes a new design that connects ground pins inside the connector with ground bars. This ground connection design lowers crosstalk, thus improving the insertion-loss to crosstalk ratio and increasing transmission speed capability. "Featuring a new, patent pending three-piece floating concept that provides smooth contact movement, the FX10-3 Series mezzanine connector saves assembly time and costs when mating multiple connectors on the same printed circuit board. The three-piece design also offers excellent signal integrity characteristics to deliver 15Gbps transmission required in high-speed applications," said Bill Kysiak, product marketing manager for Hirose Electric USA.