Versatile USB 3.0 to FIFO interface bridge chip suitable for a range of applications

05-01-2016 | Farnell element14 | Semiconductors

FTDI's FT60x series SuperSpeed USB3.0, a USB 3.0 to FIFO interface bridge chip, is now available from Farnell element14. The versatile device is suitable for a range of applications including industrial imaging, digital camera and video camera interface and upgrading legacy peripherals to USB. Features include : 1 - Support for USB3.0 SuperSpeed (5Gbps), USB High Speed (480Mbps) and USB 2.0 Full Speed (12Mbps) transfer. 2 - Available with either 16bit / 32bit wide parallel FIFO interface. 3 - Supports 2 parallel slave FIFO bus protocols, with data bursting rate up to 400Mbps. 4 - Supports multi-channel FIFO interface. 5 - Up to 8 configurable endpoints (pipes).
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By Electropages Admin