03-09-2015 | Congatec | Subs & Systems
Parallel to the launch of the new 6th-generation Intel Core processors (codename Skylake), four new COM Express compact modules have been introduced by Congatec.
The new modules are specially designed for challenging applications that demand high performance in sealed, fanless system designs. They feature a 15W configurable TDP and are equipped exclusively with the energy-saving ULV-SoC editions based on new 14nm microarchitecture. Compared to 15W modules with fifth-generation processors (codename Broadwell), users benefit from improvements in graphics and processing performance, enhanced energy efficiency and more high-speed I/Os.
Typical fanless applications for congatec COM Express compact modules can be found in medical and industrial imaging, central control room technology, shop floor terminals, HMIs, robotics, professional gaming, infotainment, professional AV, smart video surveillance, autonomous vehicle control, computer-aided situational awareness as well as high-end digital signage applications. Graphics card free, triple-head systems - for example in the areas of retail and kiosks, where embedded systems control up to three independent cash or vending machines.
"We have made the new conga-TC170 COM Express compact modules available parallel to the launch of the new Intel Core processors as our customers want to get this latest technology out in the market as fast as possible", said Gerhard Edi, CTO, Congatec.
Samuel Cravatta, product line director, Internet of Things Group, Intel, added: "Congatec's new Computer-on-Modules built with 6th generation Intel Core processors provide blazing fast compute and graphics performance, additional high speed I/Os for greater system flexibility, and a wide range of power, feature, and performance options to meet any IoT application."
Users of the new computer modules will benefit from the high level of standardization and scalability of the COM Express modules combined with Congatec's extensive documentation, industry-grade driver implementations and extensive customer support, which enable OEMs to integrate the latest processor technology quickly and efficiently into their individual applications. All modules are offered with long-term availability and software support of at least seven years. The software support includes, for example, enhanced security features as well as regular UEFI/BIOS updates and BSP patches. Users thus benefit from reliable support over the entire lifetime of their applications, says the company.
