Epoxy with ultra-low thermal resistance and superior insulation properties

Featuring special high thermal conductive fillers, Master Bond EP48TC is a new two-part epoxy paste that can be applied in bond lines as thin as 10-15 microns. The material offers exceptionally low thermal resistance of 5 - 7 x 10 - 6Km2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20 - 25 BTUin/ft2hrF [2.88-3.60 W/(mK)]. It can be used in applications in the aerospace, electronics, optical, specialty OEM and many other high-tech industries. EP48TC has a tensile lap shear strength ranging from 900-1,100 psi and bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many plastics. Even in thin sections, its strength retention is outstanding. It also has a low coefficient of thermal expansion, low shrinkage upon curing and excellent dimensional stability. EP48TC has a forgiving 100 to 40 mix ratio by weight, or 100 to 50 mix ratio by volume. The working life for a 100 gram batch at 75F is 90-120 minutes. The epoxy cures at room temperature or more quickly at elevated temperatures. It is serviceable over the temperature range of -100F to +300F, says the company.