High-yield fluid dispensing technologies for panel-level and wafer-level packaging

21-08-2025 | Nordson Electronics Solutions | Semiconductors

Nordson Electronics Solutions will be demonstrating its latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025.

On display will be the ASYMTEK Vantage dispensing system, configured with two ASYMTEK IntelliJet jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The system provides several new and innovative configurations to satisfy the demands of today's evolving technologies, like panel-level packaging. The system is a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Plasma treatment removes impurities and activates surfaces to improve flow and adhesion for enhanced semiconductor package reliability. The company's experts in plasma treatment will be available to discuss how customers can employ this technology for successful advanced packaging operations.

The theme for event is 'Leading with Collaboration. Innovating with the World', showcasing how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.

Visit the company's stand at SEMICON Taiwan 2025, booth i2326, 10-12 September 2025.

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By Nigel Seymour

Nigel has worked in the advertising and magazine publishing industry for many years prior to helping publish articles in the early years of Electropages. He has worked with technical agencies producing documents and artwork for the web over the last few years. He has been products editor for Electropages for over five years.
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