Toshiba


World’s first 16-die stacked NAND flash memory with TSV technology

Toshiba has development what it believes to be the world’s first 16-die (max.) stacked NAND flash memory utilising Through Silicon Via (TSV) technology. Previously, stacked NAND

New Technologies | 06-08-2015

World’s first 256Gb 48-layer BiCS FLASH features innovative 3D-stack structure

Toshiba has unveiled its new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory - a structure stacking Flash memory cells vertically on a silico

Products | 05-08-2015

Native and advanced-format drives with 12Gbit/s SAS interface

Toshiba Electronics Europe (TEE) has announced the addition of 512 native and advanced-format drives with 12Gbit/s SAS interface to its 15,000rpm Enterprise Performance Class HDD m

Products | 12-03-2015

New ARM Cortex-M4F based MCUs for both home and industrial motor control

Aimed at both home and industrial appliances, two new ARM Cortex-M4F based microcontrollers have been introduced by Toshiba Electronics Europe. The TMPM470FDFG and TMPM475FDFG

Products | 29-01-2015

Latest SSHDs with NAND capabilities deliver high capacity and speed

Equipped with proprietary 19nm second-generation NAND flash memory (NAND), Toshiba Electronics Europe (TEE) has unveiled its new solid state hybrid drive (SSHD) series. The MQ02AB

Products | 06-01-2015