Electronics Articles

Electropages Insights Blog covers the latest in electronic design through webinars and articles. Delve into topics from sensors to AI implications. Stay ahead with Electropages.


LTE-A throughput hits 1 GBit/s

Test and measurement company Anritsu has demonstrated peak throughput for an LTE-Advanced (LTE-A) device and network simulator using 3CA (3x Carrier Aggregation) and 4x4 MIMO with 256QAM modulation. The demonstration employed devices featuring the Qualcomm Sna...

Insights | By Paul Whytock | 09-03-2016

Embedded World via Stansted World – a game of two technological halves

The other week I returned from the excellent Embedded World exhibition in Nuremberg which in my opinion is now one of Europe's best electronics exhibitions and ranks right up there with its Munich-based rival Electronica which happens later this year. But coul...

Articles | By Paul Whytock | 09-03-2016

Embedded World via Stansted World – a game of two technological halves

The other week I returned from the excellent Embedded World exhibition in Nuremberg which in my opinion is now one of Europe's best electronics exhibitions and ranks right up there with its Munich-based rival Electronica which happens later this year. But coul...

Insights | By Paul Whytock | 09-03-2016

The 5 important things to consider when selecting a relay

Although newer technologies have replaced electromagnetic relays in some applications, electromechanical relays still have a lot to offer. These robust and versatile relays suit high voltage applications or those that require galvanic isolation between termina...

Articles | By Martin Keenan | 02-03-2016

The 5 important things to consider when selecting a relay

Although newer technologies have replaced electromagnetic relays in some applications, electromechanical relays still have a lot to offer. These robust and versatile relays suit high voltage applications or those that require galvanic isolation between termina...

Insights | By Martin Keenan | 02-03-2016

Distributors Embrace IoT and the Maker Market at Embedded World

At Embedded World, many distributor announcements covered expansion in European markets, a new focus on hobbyists and makers, and of course, the IoT. Sally Ward-Foxton reports. Embedded World, with more than 30,000 visitors over three days, is a prime oppo...

By Sally Ward-Foxton | 01-03-2016

Scope can cope with multi-domain applications

Embedded World Exhibition, Germany: Electronic design engineers must be able to perform complex measurement tasks quickly and accurately and making its debut at the show was Rohde & Schwarz' R&S RTO2000, a fast and compact lab oscilloscope for multi-do...

Articles | By Paul Whytock | 25-02-2016

Scope can cope with multi-domain applications

Embedded World Exhibition, Germany: Electronic design engineers must be able to perform complex measurement tasks quickly and accurately and making its debut at the show was Rohde & Schwarz' R&S RTO2000, a fast and compact lab oscilloscope for multi-do...

Insights | By Paul Whytock | 25-02-2016

Gecko gang breaks into IoT connectivity

Embedded World Exhibition, Germany: A wireless-focused Gecko family of multiprotocol system-SoCs designed to provide flexible connectivity options for Internet of Things (IoT) devices has been launched here at the Nuremberg show by Silicon Labs. The SoCs integ...

Articles | By Paul Whytock | 24-02-2016

Gecko gang breaks into IoT connectivity

Embedded World Exhibition, Germany: A wireless-focused Gecko family of multiprotocol system-SoCs designed to provide flexible connectivity options for Internet of Things (IoT) devices has been launched here at the Nuremberg show by Silicon Labs. The SoCs integ...

Insights | By Paul Whytock | 24-02-2016

Smallest IO-Link Transceiver is big on heat dissipation

Embedded World Exhibition, Germany: Dissipating sufficient heat from small packages is a long-standing design challenge but industrial systems engineers may well be interested in an IO- Link dual-channel transceiver that dissipates the lowest heat in what Maxi...

Articles | By Paul Whytock | 23-02-2016

Smallest IO-Link Transceiver is big on heat dissipation

Embedded World Exhibition, Germany: Dissipating sufficient heat from small packages is a long-standing design challenge but industrial systems engineers may well be interested in an IO- Link dual-channel transceiver that dissipates the lowest heat in what Maxi...

Insights | By Paul Whytock | 23-02-2016