Analog Devices announces breakthrough to accelerate 5G wireless infrastructure

27-06-2019 |   |  By Rob Coppinger

A new solution for millimetre wave (mmWave) 5G networks with the highest available level of integration to reduce design requirements and complexity in the next generation of cellular network infrastructure has been announced.

Produced by the industry leader in radio frequency (RF), microwave technology and system design for 5G infrastructure, Analog Devices (ADI), has created a mmWave solution that combines its advanced beamformer integrated circuit (IC), with up and down frequency conversion along with additional mixed signal circuitry. Millimetre wave refers the radio frequency spectrum from 24GHz to 100GHz, which have a very short wavelength.

This new mmWave 5G chipset includes the 16-channel ADMV4821 dual/single polarization beamformer IC, 16-channel ADMV4801 single-polarization beamformer IC and the ADMV1017 mmWave UDC. The 24- to 30 GigaHertz (GHz) beamforming + UDC solution forms a 3GPP 5G NR compliant mmWave front-end to address the n261, n257 and n258 bands.

“Millimetre-wave 5G is an emerging technology with great potential,” said ADI Microwave Communications general manager, Karim Hamed. “It can be extremely difficult to design these systems from the ground up, balancing system-level challenges in performance, standards, and cost.”



Flexibility

This new solution leverages ADI’s best-in-class technology, long legacy in RF, microwave and mmWave communications infrastructure. It also encompasses the deep expertise across the RF spectrum to simplify the design process for customers, reduce overall component count, and accelerate the path to 5G deployment.

The high channel density, coupled with the ability to support both single- and dual-polarisation deployments, greatly increases system flexibility and reconfigurability for multiple 5G use cases while best-in-class equivalent isotropically radiated power (EIRP) extends radio range and density. ADI’s heritage in mmWave allows customers to take advantage of world class applications and system design to optimise complete lineups for thermal, RF, power and routing considerations.


By Rob Coppinger

Rob Coppinger is a freelance science and engineering journalist. Originally a car industry production engineer, he jumped into journalism and has written about all sorts of technologies from fusion power to quantum computing and military drones. He lives in France.

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