MOSFET for e-scooters and LEVs delivers improvements in thermal management and power efficiency

Magnachip Semiconductor Corporation has released a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. The company has already begun supplying the new MOSFET to a leading global electric motor manufacturer.

The TOLT-packaged MOSFET provides a major advancement in thermal management. Unlike traditional TOLL (TO-Leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top through a mounted metal heat sink. This innovative structure greatly lowers thermal resistance between the junction and the external environment, making it ideal for thermally demanding applications, such as e-scooters and LEVs.

Simulations and tests conducted by the company demonstrated that the new 80V MV TOLT package solution achieved an average 22% reduction in junction temperature compared to employing standard TOLL packages. This improvement not only extends an application’s lifespan but also improves the system's reliability. Also, the TOLT package allows compact, lightweight application designs thanks to its high power density and efficient thermal flow that does not compromise current-handling capability and thermal safety margins.

“This new 80V MXT MV MOSFET, equipped with the TOLT package, is a testament to Magnachip’s advanced capabilities in high-performance and energy-efficient power semiconductors,” said YJ Kim, CEO of Magnachip. “We remain committed to delivering next-generation solutions that address evolving customer needs to strengthen our position in the global power market.”