High-performance interconnect systems allow for increased density and simplified PCB design

15-01-2024 | Samtec | Industrial

Samtec, Inc. now offers the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to utilise micro-footprint high-performance optical and copper interconnects interchangeably. Comprising a transceiver, two-piece connector system, and cable, the FireFly Micro Flyover System supports 14, 16, 25, and 28Gbps designs in x4, x8, and x12 configurations. The products are supported by 3D models, a PCI Express-over-Fiber adaptor card, and evaluation kits available on the website as part of Samtec Sudden Service.

Ideal for use in high-performance designs such as AI/high-performance computing, medical, test and measurement, and FPGA applications, the model ECUO FireFly Active Optical Micro Flyover System cable assembly supports up to 56Gbps PAM4 SerDes and is created for near package placement. An extended temperature version (model ETUO) for defence, aerospace, and industrial applications operates across -40C to +85C and demonstrates error-free transmission during applied external shock and vibration test methods specified in MIL-STD-810. (The cost-optimised ECUE model comes with copper cable assembly.)

Ideal for high-density applications such as ATE, mil/aero, broadcast video, and factory automation, model PCUO transmits PCIe 3.0/4.0 data rates and two sideband signals up to 100m. The extended temperature version, PTUO, operates across -40C to +85C with a BER of better than 1E-12. (The cost-optimised PCUE series comes with a copper cable assembly.)

Products in the system achieve performance from 14 to 28Gbps in a miniature footprint covering an area of only 0.63in² for an aggregate 265Gbps/in². All models are interchangeable with FireFly copper or optical cable. The connector system provides the industry's leading miniature footprint, measuring only 11.25mm x 21.08mm, permitting close proximity to the ASIC module.

The rugged two-piece edge card socket system, with weld tabs, latch locking mechanism, and loading guides, delivers simplified mating and unmating of the cable assemblies as compared to compression systems, which use mechanical screw downs and hardware. An integral heat sink, offered as finned, flat, fiber-groove, or custom-designed, further simplifies assembly while improving thermal performance. There are various high-density and rugged end options available.

The signal integrity design is made significantly easier by taking the data connections 'off-board' with Samtec Flyover cables and improving electrical performance.

The company offers three evaluation kits to support the system: the 14Gbps FireFly FMC Development Kit, 25/28Gbps FireFly FMC+ Development Kit, and 28Gbps FireFly Evaluation Kit.


By Seb Springall