Mechanically decoupled ultrasonic modules for collision avoidance

22-09-2023 | TDK | Test & Measurement

TDK Corporation offers the ultrasonic sensor module USSM1.0 PLUS-FS, where the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor (B59110W2111W032) immune to external mechanical vibrations that can falsify the measurement result. The module, provided with a nominal voltage of 12V, can be mounted in a front chassis through an M19 thread with a locking nut or via snap hooks.

Actuated through a driver and an integrated piezoelectric disk, the integrated signal processor ASIC can calculate the signal propagation time with a repetition rate of up to 50 samples/s. This enables measuring distances from 18cm to 200cm; in pitch-and-catch mode with several modules, even measuring distances of 4cm are possible. The FoV of the module, which the customer can optimise to suit their needs, is ±35°. Therefore, individual measurement scenarios can also be programmed. The sensor module is appropriate for a wide range of brightness conditions, including full sunlight, and measures extremely accurately regardless of the colour and translucence of the target object.

The ultrasonic modules are ideal for distance measurement and obstacle detection under difficult environmental conditions in AMR or AGVs.

By Seb Springall