Flexi-rigid material for critical aerospace and defence applications

09-08-2022 | Ventec | Subs & Systems

Ventec now offers tec-speed 4.0 (VT-462(L) PP NF/LF), an FR 4.0 pre-preg material to its flex-rigid No Flow/Low Flow range. It claims to provide high-Tg, low Dk, low loss, and superior thermal reliability.

The IPC-4101E compliant material is intended for critical industries, including high-reliability aerospace/space and defence. It is ideal for harsh environments and all flex-rigid applications with high BPS data rates, high speed, flex-rigid connectors, plus high frequency and high-speed applications, satellite communications, navigation systems and GPS.

With high Tg (175C), high Td (360C), and a low Dk of 3.8, it offers class-leading thermal performance and ease of manufacturing, providing better board design for applications demanding critical thermal management in the most severe environments. Customers can select between glass fabric options of 1067, 1078, and 1080 with pressed thicknesses from 2.2 to 3.3mil/ply (0.056 to 0.084mm/ply). It is lead-free assembly compatible, fulfils RoHS and WEEE requirements, and complies with UL94 V-0.

In line with the company's strict manufacturing and supply processes for all its materials, it is manufactured employing rigorous quality-controlled processes accredited with AS9100 and IATF quality standards and conversant with applicable IPC, space agency and MIL-STD specifications.