New OSM-compatible SiP for industrial and IoT applications

22-07-2022 | Aries Electronics, Inc. | Design & Manufacture

The new SiP "MSMP1" from ARIES Embedded is based on the ST Microelectronics' STM32MP1 CPU family with powerful single or dual Arm CortexA7 cores (up to 800MHz), together with a CortexM4 core (up to 209MHz). The SiP is compliant with SGET's OSM standard.

"Almost all functions of the CPU are available on the small board measuring only 30mm x 45mm," explained Andreas Widder, managing director of ARIES Embedded. "The 476 contacts of the SiP module allow the CPU to be used transparently in demanding applications. It features low power consumption, small form factor, and competitive cost."

The SiP is ideal for IoT, medical technology, and industrial systems applications.

The MSMP1 modules are scalable in terms of performance and memory expansion and can, therefore, be individually adapted to multiple project needs. The SiPs support 512MB to 4GB DDR3L RAM and 4 to 64GB eMMC NAND Flash. The many interfaces include 10/100/1000 Mbit Ethernet, USB2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC/DAC, and a parallel display interface and camera input. The modules are offered in the commercial temperature range, from 0C to +70C, and in the industrial temperature range, from -40C to +85C.

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