AuSn pastes for the higher processing temperatures of high-power LEDs

16-06-2022 | Indium Corporation | Subs & Systems

Indium Corporation has extended its portfolio of pastes with two new AuSn pastes created for the higher processing temperatures, and assembly needs required for usage in high-power LED module array applications, including automotive, infrastructure, and horticulture.

It produces a broad variety of solder paste products to satisfy the current and evolving demands of the industry. High-power LEDs can offer far higher levels of light output than conventional LEDs while also delivering higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated – in such a localised area – a high-melting and high-reliability solder is needed for assembly.

It is also essential to the LED assembly process that the solder interface between the diode and its substrate is void-free to generate a stable transmission of light and provide for the transfer of the immense heat produced by the diodes to maintain the temperature stability of the device.

AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes formulated to satisfy higher processing temperatures while delivering high reliability.

These pastes are provided in various AuSn alloys and powder sizes. As well as being excellent for use in high-power LED module array applications, they are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.

By Nigel Seymour

Nigel has worked in the advertising and magazine publishing industry for many years prior to helping publish articles in the early years of Electropages. He has worked with technical agencies producing documents and artwork for the web over the last few years. He has been assisting in editing product articles for Electropages over the last couple of years, recently taking on the role of Products Editor.