Indium Corporation has extended its portfolio of pastes with two new AuSn pastes created for the higher processing temperatures, and assembly needs required for usage in high-power LED module array applications, including automotive, infrastructure, and horticulture.
It produces a broad variety of solder paste products to satisfy the current and evolving demands of the industry. High-power LEDs can offer far higher levels of light output than conventional LEDs while also delivering higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated – in such a localised area – a high-melting and high-reliability solder is needed for assembly.
It is also essential to the LED assembly process that the solder interface between the diode and its substrate is void-free to generate a stable transmission of light and provide for the transfer of the immense heat produced by the diodes to maintain the temperature stability of the device.
AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes formulated to satisfy higher processing temperatures while delivering high reliability.
These pastes are provided in various AuSn alloys and powder sizes. As well as being excellent for use in high-power LED module array applications, they are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.