1700V IGBT7 enable highest power densities for multiple applications

13-05-2022 | Infineon | Semiconductors

Infineon Technologies AG now offers the new TRENCHSTOP 1700V IGBT7 chip in the standard industrial package EconoDUAL 3. With this new chip technology, the device provides a leading current of 900A and 75 A, and allows an improved power range for inverters. The modules are aimed at a wide range of applications, including wind, drive and SVG.

Compared to modules with the past IGBT4 chipset, the FF900R17ME7_B11 with the chip allows up to 40% higher inverter output current in the same package size. The new modules also provide notably lower static and dynamic losses while addressing applications with prevailing static losses in diode chips. Also, the new chip technology provides enhanced du/dt controllability and enhanced diode softness. Induced by cosmic rays, the FIT rate has also been greatly improved – an important parameter when operating with high DC link voltage. Furthermore, the new power modules provide a maximum overload junction temperature of 175C.

As well as best-in-class 1700V EconoDUAL 3 with 900A, a 750A module with a larger diode has also been released to increase the flexibility of the new portfolio further. Overall, the new modules with the TRENCHSTOP IGBT 7 chip can improve the power density of the inverter and attain a new level of performance in a broad spectrum of applications.

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