Expanded high-density FPC-to-board/board-to-board connector family

22-06-2021 | Hirose | Connectors, Switches & EMECH

Hirose has created an innovative FPC-to-board/board-to-board connector series that provides high-density mounting and space savings. Supporting USB4 Gen2 (10Gbps) transmission for a wide variety of portable electronic and consumer devices, the DF40 Series combines a 0.4mm pitch with a mounting depth of just 3.68mm.

The robust connector series offers a superior stamped contact design with a distinct tactile click that verifies secure mating. The stamped contacts allow a longer effective mating length of 0.45mm that gives shock and vibration resistance common to portable device applications. Further guarding signal contacts, the series possesses curved contacts to stop buckling during mating.

The series is offered in several versions, with stacking heights ranging from 4mm down to 1.5mm. The FPC-to-board connector family comprises a high-temperature version, a positive lock version, EMC shielded versions and versions with or without retention tabs.

"Hirose continues to develop innovative and impactful products that meet our customers’ application requirements," said Mark Kojak, VP of sales and marketing for Hirose Electric USA. "The miniature DF40 Series enables customers to go develop smaller end-products without sacrificing performance or reliability."

The series is offered in various positions ranging from 10 to 120, depending on the variations. The connector has a rated voltage of 30VAC and a standard operating temperature of -35C to +85C. The high-temperature version is rated up to 125.

By Natasha Shek