Thermal interface materials provide high thermal conductivity

10-05-2021 | Parker Hannifin plc | Subs & Systems

The Chomerics division of Parker Hannifin Corporation has launched THERM-A-GAP GEL 75, a 7.5W/m-K single component dispensable thermal interface material designed for high-performance applications.

The product is a single component, gel material best suited for today’s high-powered electronics applications. When applied to a heat-generating component, it gives minimal stress and pressure due to its low compression force and offers the highest thermal conductivity dispensable available from the company. Its flow rate is nearly three times faster than the next closest performing material in the family.

The product is ideal for high volume, automated production, specifically seen in telecommunications equipment, automotive safety electronics modules, power supplies, and memory and power modules.

“GEL 75 was formulated to accommodate the future high-power demands of many different markets, including 5G enabled telecom infrastructure, automotive applications -- any application that is seeing increased bandwidth demands that generate excessive heat,” says Brian Mahoney, global thermal business unit manager, Parker Chomerics. “It is the next evolution in our THERM-A-GAP gap filler family of easy to use, reliable, high performance, single-component dispensable gels.

It is now available globally in different sizes of syringes, cartridges, and pails to suit a broad variety of customer needs.