Digital PoL regulator in compact SIP for telecom and datacom applications

05-05-2021 | Flex Power Module | Power

Flex Power Modules has launched the BMR474, a high-power density, digital non-isolated PoL regulator. Due to its vertically mounted SIP (single inline package) design, the device saves precious board space, while being able to provide up to 80A output current, with a maximum power output of 198W.

Created for telecom and datacom applications, the device provides an attractive price to performance ratio, and provides efficiency levels as high as 95.1% at 12Vin, 3.3Vout, full load.

The input voltage range is 6V to 15V, and the output voltage can be altered from 0.6V to 3.3V. For output voltages up to 1.8V, the device can provide up to 80A output current, whilst for output voltages over 1.8V, the maximum output current is 60A. Ripple and noise is 5mV at 12Vin, 1Vout, full load.

The device is simple to set up through its PMBus digital interface, which gives extensive monitoring, configuration and control capabilities. It is also supported by Flex Power Modules’ Power Designer software, which makes design and debug easier. Utilising the software’s simulation functions, it is straightforward to optimise the configuration parameters, indicating designers can deliver a stable control loop with a fast load transient response.

The regulator has an operating temperature range of -40C to +125C and satisfies safety requirements according to IEC/EN/UL 62368-1. For maximum reliability, it comprises under-voltage, over-voltage, over-temperature and over-current protection mechanisms. This allows it to deliver a long operational lifespan, with an MTBF of over 23 million hours.

Olle Hellgren, director Product Management and Business Development at Flex Power Modules, said: "Board space is always at a premium in telecom and datacom applications – to help customers fit the most into their designs, the BMR474 saves valuable PCB real estate, without compromising on performance or reliability.”

The new regulator is offered in a compact SIP package that measures 33mm x 8.6mm x 19mm (1.3" x 0.33" x 0.75") with a footprint of 2.84cm2.

By Natasha Shek