Wide-temperature memory modules accelerate the realisation of AIoT

19-01-2021 | Apacer | Semiconductors

Apacer has announced mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules. They utilise Samsung’s original wide-temperature grade chips to support cutting-edge platforms incorporating AMD’s Ryzen Embedded V2000 processor and Intel’s Tiger Lake and Elkhart Lake. The memory module was created to serve AIoT, edge system and high-performance computing markets that frequently face temperature swings in severe environments, such as outdoor embedded and edge devices, networked communication systems, telecommunication systems and cloud equipment. This ideal industrial-grade, high-speed and wide-temperature complete solution offers long-term reliability, stability and product life for the system, and will speed the realisation of AIoT and edge high-performance computing applications.

The company continues to invest in the three major aspects of ESG (Environmental, Social, and Corporate Governance), and the goal of product development is to offer solutions for customers that will develop the usage of energy and resources. The company drew on over 20 years' experience to produce a comprehensive range of DDR4-3200 modules in the UDIMM, SODIMM, ECC UDIMM, ECC SODIMM and RDIMM form factors. 8GB, 16GB and 32GB capacities are all available. Value-adding features including anti-sulfuration, conformal coating, and underfill, can be added to shield them from corrosion, vibration, moisture, dust and thermal shock. From end to edge to cloud, the company's full range of wide-temperature memory modules will noticeably increase the stability and reliability of systems for long-term operation in harsh environments.

By Natasha Shek