Anti-vibration memory accelerates upgrade of defence and transportation systems

16-10-2020 | Apacer | Semiconductors

Apacer has released a robust DDR4 Rugged SODIMM anti-vibration memory module, which is aimed at defence and industry applications that suffer from high-vibration environments. The product can assist industrial vertical markets including 5G base stations, energy exploration, aerospace defence, wind power generation, railways and transportation systems painlessly upgrade rugged applications to make them more robust. The SODIMM complies with the JEDEC DDR4 SODIMM industry standard and is compatible with current motherboards, significantly reduces the cost of rugged system development and improving product price competitiveness.


The SODIMM has passed the aerospace RTCA DO-160G anti-vibration test and has earned a defence-standard MIL-STD-883K certification. It is created in accordance with the JEDEC 260-Pin DDR4 SODIMM standard specification and is fitted with a double mounting-hole design to secure the memory module tightly and firmly on the motherboard. The stability and reliability of data transmission can be maintained even in high vibration and shock environments. Also, the memory is compatible with standard DDR4 SODIMM sockets, which can save the high cost of buying extra connectors, and there is no requirement to redesign the system, which assists in shortening the overall system development time.


On the other hand, considering that 5G base stations, energy exploration, aerospace defence, wind power generation, railways and transportation systems often require operating in harsh outdoor environments, the SODIMM has a built-in thermal sensor, which can monitor the temperature of the memory module in real-time and decrease the risk of overheating. At the same time, it supports a broad temperature range operation, conformal coating and anti-sulfuration technology, and offers a further layer of protection against environmental challenges. These value-added technologies assist in protecting the memory module from external factors such as high humidity, high temperature, and high pollution environments and extend the overall lifespan of the system.

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