First COM-HPC and next-gen COM Express now available

09-09-2020 | Congatec | Subs & Systems

In parallel with the 11th Gen Intel Core processor launch (code named 'Tiger Lake'), Congatec has announced the availability of both its first COM-HPC Client size - a module and next-generation COM Express Compact Computer-on-Module. This offers engineers the option to further scale the performance of their current systems or develop the next generation of products utilising COM-HPC’s broader collection of interfaces. OEMs will profit from the substantial performance enhancements as well as communication improvements that the new modules based on 11th Gen Intel Core processors provide to the high-end computing sector. Typical applications can be seen in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centres to core network appliances, as well as ruggedised central cloud data centres for crucial government applications.


“Congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” explains Gerhard Edi, CTO at Congatec.


“For the first time, design engineers now have the choice to go either with COM Express or COM-HPC. Each provides unique benefits, for example, we have an improved next-gen connector for COM Express that is expected to offer better bandwidth capacities compared to what was available in the past. This is essential information for engineers thinking about utilising the high bandwidth interfaces such as PCIe Gen 4. Engineers choosing COM-HPC will benefit from by far more high-speed interfaces delivered over 800 signal pins in total. This is almost twice as many pins as COM Express Type 6 modules deliver with 440 pins,” explains Andreas Bergbauer, product line manager at Congatec.

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