KEMET Electronics KC-LINK Capacitors with KONNEKT Technology, available now from Mouser are surface-mount capacitors created for high-efficiency and high-density power applications. KONNEKT high-density packaging technology employs an innovative transient liquid phase sintering material to produce a surface mount multi-chip solution for high-density packaging. By using the company's robust and proprietary C0G base metal electrode dielectric system, these capacitors are ideal for power converters, inverters, snubbers, and resonators, where high efficiency is important.
The technology facilitates a low-loss, low-inductance package able to handle extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Providing an operating temperature range up to 150C, these devices can be mounted close to fast switching semiconductors in high power density applications. The technology also displays high mechanical robustness when compared to other dielectric technologies, enabling the capacitor to be mounted without the aid of metal frames.
The capacitors can also be mounted in a low-loss orientation to increase power handling capability even further. The low-loss orientation reduces ESR and ESL, which increases ripple current handling capability.