09-07-2020 | Bostik | Subs & Systems
Bostik has launched a new range of innovative engineering adhesives called Born2Bond. The product is designed for ‘by-the-dot’ bonding in the high-tech electronics manufacturing sector.
The range comprises new, low-odour formulations, which allow a more comfortable manufacturing environment, and low-blooming solutions. Blooming is the effect of adhesive being squeezed out between parts being assembled and producing staining. It is a crucial factor to avoid for high-tech electronics and communication devices where miniaturisation of parts is building new design and manufacturing challenges.
Polivio Goncalves, Bostik’s global market manager for Engineering Adhesives, states the instant engineering adhesives launched as the first in the range elevate the bar for all-round performance: “Designers and manufacturers are facing critical challenges such as the need to minimise the effects of blooming and the need for a more adaptable and faster-curing process while meeting more demanding environmental and health and safety regulations.
“Born2Bond will enable customers to improve efficiencies, increase design opportunities and enhance sustainability, making it easier for them to manufacture better, safer and ever more innovative products.”
