LTE-M solution provides the smallest form factor solution

21-05-2020 | Murata | Subs & Systems

Murata Electronics has announced that their LTE-M solution powered by Altair Semiconductor’s advanced cellular chipset has achieved Deutsche Telekom certification for running on the carrier’s German 4G LTE wireless network. Measuring just 11.1mm x 11.4mm x 1.4mm, the module is claimed to be the world’s smallest form factor solution and allows applications to move the market forward, such as mobile IoT. As well as its unparalleled size, low power, and cost-efficiency, the Type 1SC’s high level of integration cuts time to market and decreases customers’ certification costs.


The module contains Altair’s advanced cellular IoT chipset; the ALT1250. With an industry-leading low power consumption, it allows IoT devices to run for longer, giving years of operation with no need to replace batteries. Commercially available, the RoHS-compliant chipset offers a hardware-based security framework and a rich set of features as well as integrated SIM (iSIM), an ARM Cortex M4 MCU for the user’s IoT applications and GNSS, excellent for facilitating a wide-range of industrial and consumer IoT applications.


“With the Deutsche Telekom certification, mutual customers can easily tap Murata’s RF expertise and access best-in-class solutions,” said Koichi Sorada, product manager Connectivity Modules, Murata Europe.


“Murata is a leading provider of innovative building blocks for the Internet of Things, and through our strong partnership we continue to secure superior performance and quality needed for success in mobile IoT,” said Wayne Gilbert, head of IoT Device Integration and Validation at Deutsche Telekom.

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