Expanded SiC family provides system level improvements

19-03-2020 | Microchip Technology | Power

Microchip Technology has expanded its portfolio of smaller, lighter and more efficient SiC power modules. Together with its broad portfolio of MCUs and analog products, the company serves the demands of high-power system control, drive and power stage – supporting customers with total system solutions.

The company's SiC family comprises commercially qualified SBD-based power modules in 700V, 1200V and 1700V variants. The new power module family incorporates various topologies including Dual Diode, Full Bridge, Phase Leg, Dual Common Cathode and Three-Phase bridge, as well as providing different current and package options. The addition of SiC SBD modules simplifies designs by integrating multiple SiC diode die with the opportunity to mix and match substrate and baseplate material into a single module – which maximises switching efficiency, decreases thermal rise and provides for a smaller system footprint.

“SiC technology adoption and expansion is a driving force in today’s system innovation, and Microchip is at the forefront, collaborating with customers across all segments and global regions,” said Leon Gross, vice president of Microchip’s Discrete Product Group business unit. “Our focus continues to be delivering reliable and innovative solutions. From definition to product release, our SiC technology provides superior reliability and ruggedness, helping power system designers to ensure a long application life with no degradation in performance.”

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