Small ultra-thin bus switches save board space

Diodes Incorporated has released its family of quad- and dual-channel 4:1 and 2:1 bus switches which are now available in an ultra-thin QFN (UQFN) package. The package makes it simpler for OEMs to improve PCB density and decrease product dimensions when creating PC notebooks and tablets as well as networking and telecommunications equipment.

Discrete logic devices, including bus multiplexers and demultiplexers, continue to be a critical element of embedded design. The UQFN package measures only 3mm x 3mm x 0.65mm high, which is much smaller than comparable devices in standard packages. This smaller size enables the bus switches to be added to virtually any design, even those with a high level of component density.

The UQFN package employed by the devices comprises a thermal pad for more efficient heat dissipation. Also, all of the devices in the four variants highlight a very low on-resistance of only 5Ohm, a near-zero propagation delay, and ultra-low quiescent current.

Previously, the PI3B3253ZHD and PI3B3257ZHD (dual, 4:1) and the PI3CH480ZHD and PI5C3257ZHD (quad, 2:1) bus switches have only been offered in the QSOP and TSSOP packages, providing pin-compatibility with industry-standard 74 series logic devices.