Low profile power module is one of the smallest in its class

RECOM’s new addition to its DC-DC converter portfolio is one of the smallest in its class of low profile QFN-packaged buck regulator power modules. The RPX-2.5 module is excellent due to its flip-chip technology which increases power density and improves thermal management.

The company’s new power module provides a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package. The device offers an input range from 4.5VDC to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. The device offers an efficiency of up to 92%, and it is thermally optimised due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it excellent for space-constrained applications.

To facilitate rapid testing, the company also provides an evaluation board for this product so that customers will be able to quickly and easily test.