Indium Corporation is a major provider of indium metal and associated technologies. Due to its unique properties if offers virtually limitless applications – indium metal is all around us.
The metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminium, efficiently removes process heat, making it a favoured choice for burn-in and test.
Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminium is employed to decrease the sticking. It is much more expensive to test at the board level, once the components have been soldered to the board than to test every single chip.
The company’s Heat-Spring thermal interface material is created to be employed as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximises the Heat-Spring’s thermal resistance and enhances cooling.