Rugged memory module offers exceptional reliability and flexibility

03-07-2018 | Apacer | Semiconductors

Apacer has launched the latest rugged memory module XR-DIMM, showcasing exceptional reliability and flexibility space usage.

The company’s rugged memory XR-DIMM uses the innovative board-to-board connector design to fit tightly and securely onto the motherboard. Also, it adopts the highly durable 300-pin connector and mounting holes to efficiently prevent memory modules from dislocating or coming away due to vibration or strong impact. This hugely improves the reliability of memory signal transmissions, serving as the strongest support for applications working in severe environments.

The device’s sealed board-to-board connector is designed to cope with the severe environments of automotive electronics and defence and aerospace fields, avoiding the traditional memory’s gold finger’s problem of possible oxidation when exposed to outdoor contaminating environments.

The XR-DIMM’s connector design meets the anti-vibration and anti-shock standards of MIL-STD-810 and ANSI/VITA 47-2005. XR-DIMM is compatible with DDR4 2133/2400 specification, supports ECC function and comes in two capacity choices of 8GB and 16GB. Having innovative anti-vibration design and multiple protection technologies, The company claims the XR-DIMM is the world’s only memory product that is not only anti-vibration, high and low-temperature resistant, but also anti-humidity, anti-dust and anti-sulfuration. It is a powerful product within the memory industry and opens up endless possibilities for the future development of smart applications.

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